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ARS-121L-DNR

  • High density 1U 2-node GPU system with Integrated NVIDIA® H100 GPU (1 per Node)
  • NVIDIA Grace™ CPU Superchip (144-core per node)
  • NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and CPU at 900GB/s
  • Up to 480GB LPDDR5X onboard memory
  • 2x PCIe 5.0 x16 slots per node supporting NVIDIA BlueField®-3 or ConnectX®-7
  • Up to 4x Hot-swap E1.S drives and 2x M.2 NVMe drives per node
  • 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
Product SKUs
ARS-121L-DNR (Silver)
    Motherboard
    Super G1SMH
      Processor (per Node)
      CPU
      • Single C2
      • NVIDIA Grace™ CPU Superchip
      Note
      • Supports up to 500W TDP CPUs (Air Cooled)
      GPU (per Node)
      Max GPU Count
      • Up to 1 double-width or 1 single-width GPU(s)
      GPU-GPU Interconnect
      • PCIe
      System Memory (per Node)
      Memory
      • Up to 480GB: Onboard LPDDR5X
      On-Board Devices (per Node)
      Chipset
      • System on Chip
      Network Connectivity
      • 1x 1GbE BaseT with NVIDIA ConnectX®-7 or Bluefield®-3 DPU
      Input / Output (per Node)
      LAN
      • 1 RJ45 1GbE (Dedicated IPMI port)
      System BIOS
      BIOS Type
      • AMI 64MB SPI Flash EEPROM
      PC Health Monitoring
      CPU
      • 8+4 Phase-switching voltage regulatorMonitors for CPU Cores, Chipset Voltages, Memory
      FAN
      • Fans with tachometer monitoringPulse Width Modulated (PWM) fan connectorsStatus monitor for speed control
      Temperature
      • Monitoring for CPU and chassis environmentThermal Control for fan connectors
      Chassis
      Form Factor
      • 1U Rackmount
      Model
      • CSE-GP102TS-R000NDFP
      Dimensions and Weight
      Height
      • 1.75″ (44mm)
      Width
      • 17.33″ (440mm)
      Depth
      • 37″ (940mm)
      Package
      • 9.5″ (H) x 48″ (W) x 28″ (D)
      Weight
      • Net Weight: 48.5 lbs (22 kg)
      • Gross Weight: 65.5 lbs (29.7 kg)
      Available Color
      • Silver
        Expansion Slots (per Node)
        PCI-Express (PCIe)
        • 2 PCIe 5.0 x16 FHFL slot(s)
        Drive Bays / Storage (per Node)
        Hot-swap
        • 4x E1.S hot-swap NVMe drive slots
        M.2
        • 2 M.2 NVMe
        System Cooling
        Fans
        • 7 Removable heavy-duty 4CM Fan(s)
        Power Supply
        2x 2700W Redundant Titanium Level power supplies
          Dimension(W x H x L)
          • 73.5 x 40 x 185 mm
          AC Input
          • 2700W: 200-240Vac / 50-60Hz 2700W: 240-240Vdc / 50-60Hz (for CQC only)
          +12V
          • Max: 225A / Min: 0A (200Vac-240Vac)Max: 225A / Min: 0A (240Vdc-240Vdc)
          12V SB
          • Max: 4A / Min: 0A
          Output Type
          • Backplanes (gold finger)
          Certification
          • Titanium Level     [ Test Report ]
          Operating Environment
          Environmental Spec.
          • Operating Temperature:
          • 10°C ~ 35°C (50°F ~ 95°F)
          • Non-operating Temperature:
          • -40°C to 60°C (-40°F to 140°F)
          • Operating Relative Humidity:
          • 8% to 90% (non-condensing)
          • Non-operating Relative Humidity:
          • 5% to 95% (non-condensing)
          Weight 48.5 lbs
          Dimensions 37 × 17.33 × 1.75 in
          Form Factor

          1U

          Chipset

          SoC (System on Chip)

          CPU Family

          INTEL

          CPU Type

          NVIDIA Grace™ CPU Superchip

          CPU Count

          1 CPU Sockets

          CPU Socket

          Single C2

          TDP

          500W

          Drive Bays

          2

          Drive Factor

          E1.S

          GPU Support

          1

          MAX Memory

          480GB

          Network Controller

          Bluefield-3 DPU, ConnectX-7

          Network

          1x 1GbE

          Storage

          NVMe (Native)

          Redundant PWS

          YES