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SYS-F619H6-FT

  • Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
  • 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x8 (LP) 1 PCI-E 3.0 x16 (for SIOM )
  • 12 Fixed 3.5″ SATA3 drive bays M.2 Interface: 2 SATA/PCI-E 3.0 x4 M.2 Form Factor: 2260/2280/22110 M.2 Key: M-Key
  • Networking via SIOM Network card, 1 dedicated IPMI LAN port (front)
  • 1 VGA, 2 USB 3.0 ports (front)
  • 8x 8cm rear fans per chassis per enclosure
  • 2200W Dual Power Supplies Titanium Level (96% Efficiency)

Please Note: This is a barebone system only. It does NOT include processor, system RAM, storage drives, graphics cards and an operating system. Please Contact our sales team for a complete the system quote.

SKU: SYS-F619H6-FT Categories: , , , , , , , , , , , Tag:
Processor/Cache (per Node)
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-125W
Cores
  • Up to 28 Cores
Note BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory (per Node)
Memory Capacity
  • 12 DIMM slots
  • Up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
Cascade Lake only. Contact your Supermicro sales rep for more info.
On-Board Devices
Chipset
  • Intel® C621 chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
  • Flexible networking via SIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
Input / Output (per node)
SATA
  • 14 SATA3 (6Gbps) ports
LAN
  • SIOM flexible Network card
  • 1 RJ45 Dedicated IPMI LAN port (front)
USB
  • 2 USB 3.0 ports (front)
VGA
  • 1 VGA port (front)
System BIOS
BIOS Type
  • 128Mb SPI Flash EEPROM with AMI BIOS
Management
Software
  • Intel® Node Manager
  • IPMI 2.0
  • KVM with dedicated LAN
  • SuperDoctor® 5
  • Watch Dog
Power Configurations
  • ACPI Power Management
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 4U Rackmount
Model
  • CSE-F414IS4-R2K20BP
Dimensions and Weight
Width
  • 17.63″ (448mm)
Height
  • 6.96″ (177mm)
Depth
  • 29″ (737mm)
Package
  • 28.3″ (W) x 15.0″ (H) x 42.4″ (D)
Weight
  • Net Weight: 150 lbs (68.04 kg)
  • Gross Weight: 200 lbs (90.71 kg)
Available Colors
  • Black
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • Network activity LEDs
  • Information LED (Fan failure, Overheat)
Expansion Slots (per node)
PCI-Express
  • 1 PCI-E 3.0 x16 (Low-profile)
  • 1 PCI-E 3.0 x8 (Low-profile)
  • 1 PCI-E 3.0 x16 (SIOM)
Drive Bays (per node)
Fixed
  • 12 Fixed 3.5″ SATA3 drive bays
M.2
  • M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 & 1
  • M.2 Form Factor: 2260/2280/22110
  • M.2 Key: M-Key
System Cooling
Fans
  • 8x 8cm rear fans per chassis enclosure
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power and Input
  • 1200W with Input 100-127Vac
  • 1800W with Input 200-220Vac
  • 1980W with Input 220-230Vac
  • 2090W with Input 230-240Vac
  • 2200W with Input 220-240Vac (for UL/cUL use only)
  • 2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency
  • 50-60Hz
Dimension
(W x H x L)
  • 76 x 40 x 336 mm
+12V
  • Max: 100A / Min: 0A (100-127Vac)
  • Max: 150A / Min: 0A (200-220Vac)
  • Max: 165A / Min: 0A (220-230Vac)
  • Max: 174.17A / Min: 0A (230-240Vac)
  • Max: 183.3A / Min: 0A (220-240Vac)
5VSB
  • Max: 1A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level96%  Titanium Level
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
    10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
    -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)
Weight 200 lbs
Dimensions 29 × 17.63 × 6.96 in
Form Factor

4U
Chipset

Intel C621
CPU Family

INTEL
CPU Type

Cascade Lake/Skylake, Xeon Scalable Processors
CPU Count

2 CPU Sockets
CPU Socket

LGA-3647
Nodes per Enclosure

8x Nodes
TDP

70-125W
Drive Bays

12
Drive Factor

3.5"
MAX Memory

3TB
Memory DIMM

12
Network Controller

SIOM
Network

SIOM
Storage

SATA (Native)
Redundant PWS

YES

Key Features

  • Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
  • 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x8 (LP) 1 PCI-E 3.0 x16 (for SIOM )
  • 12 Fixed 3.5″ SATA3 drive bays M.2 Interface: 2 SATA/PCI-E 3.0 x4 M.2 Form Factor: 2260/2280/22110 M.2 Key: M-Key
  • Networking via SIOM Network card, 1 dedicated IPMI LAN port (front)
  • 1 VGA, 2 USB 3.0 ports (front)
  • 8x 8cm rear fans per chassis per enclosure
  • 2200W Dual Power Supplies Titanium Level (96% Efficiency)

Please Note: This is a barebone system only. It does NOT include processor, system RAM, storage drives, graphics cards and an operating system. Please Contact our sales team for a complete the system quote.

Warranty

Warranty: 3 years Parts and labor Depot, 1 year parts advanced replacment
Provider: Manufacturer
Phone No.: 510-652-8283
E-mail: [email protected]
URL: Click here for Manufacturer Website
Coverage: Parts replacement or repair
Average Service Time: 1-5 days Replacement

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