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AS-2124GQ-NART-LCC

  • Coming Soon
  • Key Applications
  • – AI/ML, Deep Learning Training and Inference
  • – High-performance Computing (HPC)
  • – Cloud Computing
  • – Research Laboratory/National Laboratory
  • – Autonomous Vehicle Technologies
  • – Molecular Dynamics Simulation
  • Key Features
  • 1. High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio)
  • 2. Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
  • 3. Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect
  • 4. On board BMC supports integrated
  • IPMI 2.0 + KVM with dedicated 10G LAN
  • 5. Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
  • 6. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
  • 7. 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP)
  • 8. 4 Hot-swap 2.5″ drive bays
  • (SAS/SATA/NVMe Hybrid)
  • 9. 2x 2200W Platinum Level power supplies with Smart Power Redundancy
  • Get Pricing
Product SKUs
AS -2124GQ-NART-LCC
  • A+ Server 2124GQ-NART-LCC (Black)
Motherboard
    Processor/Cache
    CPU
    • Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
    • Socket SP3
    • Supports CPU TDP up to 280W*
    Cores
    • Up to 128 Cores (64 per CPU)
    Note
    • * Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
    GPU Support
    • Supports HGX A100 4-GPU 40GB (HBM2) or 80GB(HBM2e) with NVLink GPU interconnect and PCI-E Gen4 host CPUs
    GPU
    Supported GPUs
    • HGX A100 4-GPU 40GB/80GB SXM4 Multi-GPU Board
    CPU-GPU Interconnect
    • PCI-E Gen 4 x16 Direct Connect CPU-GPU Dual-Root
    GPU-GPU Interconnect
    • NVIDIA® NVLink™ GPU-to-GPU Interconnect
    System Memory
    Memory Capacity
    • 32 DIMM slots
    • Up to 8TB 3DS ECC DDR4-3200MH SDRAM
    Memory Type
    • 3200MHz ECC DDR4 SDRAM
    On-Board Devices
    Chipset
    • System on Chip (SoC)
    Network
    • Dual RJ45 10GbE-aggregate host LAN, RJ45 1GbE IPMI
    IPMI
    • Support for Intelligent Platform Management Interface v.2.0
    • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
    Graphics & System Management
    • ASPEED AST2600 BMC
    Input / Output
    SATA
    • 4 SATA3 (6Gbps) ports
    LAN
    • 2 RJ45 10GbE-aggregate host LAN ports
    • 1 RJ45 1GbE Dedicated IPMI management port
    USB
    • 2 USB 3.0 ports (rear)
    Video
    • 1 VGA Connector (rear)
    Others
    • 1 COM port (header)
    • 1 TPM 2.0 (header)
    System BIOS
    BIOS Type
    • AMI 256Mb SPI Flash ROM
    Management
    Software
    • IPMI 2.0
    • KVM with dedicated LAN
    • SSM, SPM, SUM
    • SuperDoctor® 5
    • Watchdog
    PC Health Monitoring
    CPU
    • Monitors for CPU Cores, Chipset Voltages, Memory.
    • 4+1 Phase-switching voltage regulator
    FAN
    • Fans with tachometer monitoring
    • Status monitor for speed control
    • Pulse Width Modulated (PWM) fan connectors
    Temperature
    • Monitoring for CPU and chassis environment
    • Thermal Control for fan connectors
    Chassis
    Form Factor
    • 2U Rackmountable
    Model
    • CSE-228GTS-R2K21P
    Dimensions
    Height
    • 3.5″ (89mm)
    Width
    • 17.2″ (437mm)
    Depth
    • 32.4″ (823mm)
    Available Colors
    • Black
    Drive Bays / Storage
    Hot-swap
    • 4 Hot-swap 2.5″ drive bays (SATA/NVMe Hybrid or SAS with optional HBA)
    Expansion Slots
    PCI-Express
    • 4 PCI-E Gen4 x16 (LP) slots – supporting HGX A100 4-GPU’s 1:1 connection to 4 NICs
    • 1 PCI-E Gen 4 x8 (LP) slot
    System Cooling
    Liquid Cooling
    • Power-efficient liquid cooling for CPUs and GPUs
    Fans
    • 4 Hot-swap heavy duty fans
    Power Supply
    Total Output Power
    • 1000W: 100 – 127Vac
    • 2200W: 220 – 240Vac
    Dimension(W x H x L)
    • 107 x 82 x 204 mm
    Input
    • 100-127Vac / 12-9.5A / 50-60Hz
    • 220-240Vac / 11-10A / 50-60Hz
    Output Type
    • Gold Finger Connector
    Certification
    • Platinum Level
    Operating Environment
    RoHS
    • RoHS Compliant
    Environmental Spec.
    • Operating Temperature:
    • 10°C ~ 35°C (50°F ~ 95°F)
    • Non-operating Temperature:
    • -40°C to 60°C (-40°F to 140°F)
    • Operating Relative Humidity:
    • 8% to 90% (non-condensing)
    • Non-operating Relative Humidity:
    • 5% to 95% (non-condensing)
    Dimensions 32.4 × 17.2 × 3.5 in
    Form Factor

    2U

    Chipset

    SoC (System on Chip)

    CPU Family

    AMD

    CPU Type

    EPYC 7003/7002 Series

    CPU Count

    2 CPU Sockets

    CPU Socket

    SP3

    TDP

    280W

    Drive Bays

    4

    Drive Factor

    2.5"

    GPU Support

    4

    MAX Memory

    8TB

    Memory DIMM

    32

    Network

    2x 10GbE RJ45

    Storage

    SATA (Native)

    Redundant PWS

    YES